PE-2000 Series (RIE) The Advanced Technologies Series PE-2000 Reactive Ion Etching system are designed for both research and development and low volume production in the fabrication of semiconductor, compound semiconductor, flat panel display and MEMS devices. The RIE tool is capable of high etch rates with excellent uniformity through the use of our unique reactor design that utilizes tuned gas dynamics, high gas throughput and adjustable D.C. bias levels. The unit can routinely etch sub-micron geometries in a wide variety of materials including dielectrics, semiconductors and metals using either fluorine or chlorine chemistries. The PE-2000 is available in either a batch processing or loadlock configuration.  General Specs - Compact sized at 28 inches wide, 58 inches high, and 32 inches deep. - Computer control with touchscreen user interface. - Windows NT operating software. - Turbo pumped for low pressure (high gas throughput) operation. - Tuned gas dynamics providing guaranteed etch uniformity. - Corrosive and Chlorine chemistry compatible. For more in-depth information regarding the PE-2000, please contact a sales representative. ICP Etching - PE-CVD - Mag Sputtering - Flat Panel Display