The Advanced Technologies Series PD-4000 Plasma Enhanced Chemical Vapor Deposition system is designed for production applications in microelectronic manufacturing. The system is capable of high deposition rates with excellent uniformity, while maintaining precise control over film composition. You can depend on the PD-4000 to deliver uniform and reproducible deposition of semiconductor films and other device structures. Operation of this system is made safe through the use of numerous safety features including a completely sealed and exhaustible gas enclosure for maximum safety. The PD-4000 is a high volume, batch processing unit that maximizes throughput without compromising performance or reliability. This equates to a lower cost per part and COO.
General Specs- Compact sized at 24 inches wide, 58 inches high and 32 inches deep.
- Computer control with touchscreen user interface.
- Windows NT operating software.
- 150 CFM Roots blower pump for high gas throughput.
- Tuned gas dynamics providing guaranteed deposition uniformity.
For more in-depth information regarding the PD-4000, please contact a
sales representative.
ICP Etching -
RIE -
Mag Sputtering -
Flat Panel Display
